Tungsten Creates New VIA 3D Stack
Phoronix: Tungsten Creates New VIA 3D Stack
Thomas Hellström of Tungsten Graphics is preparing to release a new DRM module and Mesa 3D driver that supports some of VIA's older hardware -- and eventually their newest graphics processors. This work done by Thomas includes a memory manager similar to the Graphics Execution Manager and a stable AGP command submission mechanism. This new code will also allow for kernel mode-setting on VIA hardware in the future. The new Mesa component features OpenGL 1.3 support, accelerated pixel operations and pixel buffer objects, S3TC compression, accelerated GL_EXT frame buffer objects, better stability, and multi-thread / multi-context operation support. The hardware supported by this new VIA 3D code is the CX700 and older Unichrome IGPs...