Few months ago, AMD launched new product line called APU.
Itís AMD dual core E-350 CPU which integrate GPU and the chipset is Hudson-M1 FCH.
This combo main competitor is Intel Atom platform, and not popular in consumer market.
E-350 CPU performance is similar to Atom, however, its GPU performance is much better than Atom which even better than AMD own IGP performance.
It breaks the trend of IGP performance slow improvement.

In the past, built-in graphic is integrating in Chipset. Since last year, Intel LGA 1155 platform integrated GPU into CPU.
It makes Intel IGP performance catch up AMD platform. This is the first time Intel lead the IGP performance.
AMD IGP is always the leader in the market.
However, each generation 3D performance improvement is small; it causes the UMA market no breakthrough products.
2011, Intel LGA 1156 changed the trend.
Early this year, Intel launched LGA1155 Sandy Bridge, the performance improves 20~30% more. Intel HD2000/3000 performance is leaping.
Finally, AMD launched new Llano APU high performance IGP structure which is the key role this review.

Llano APU chipset has A75 and A55. So far you only can find A75 products in Taiwan.
First of all, letís see GIGABYTE A75M-D2H package. It is white background and feature and technology logos.
GIGABYTE recently promotes SUPER 4 in entry products. At the first sight, I thought itís new Japanese Super Sentai series...

SUPER 4 are Super Safe, Super Speed, Super Savings, and Super Sound.
If you are interested in, you can search internet to compare with other brands A75 MB.

This year, GIGABYTE mid to high end MB is black PCB design.
Personally, I prefer water blue or sky blue color. A75M-D2H color tone is pretty good.
Itís Micro ATX and size is 24.4 cmx 22.5 cm.

Bundle Accessories
Product manual, quick installation guide, I/O panel, SATA cables and Driver CD.

Lower-Left Corner
2 X PCI-E X16, first one is X16 and second one is X4 which support AMD CrossFireX technology
1 X PCI-E X1
Realtek ALC889 audio chip supports 7.1 channel and High Definition Audio technology.
Realtek RTL8111E LAN chip and TPM module connector in black.

Lower-Right Corner
6 X Blue SATA provided by A75. Itís SATA3 and supports RAID 0, RAID 1, RAID 10, JBOD.
Left side has USB 2.0/3.0 front panel connector and right side is DualBIOS.

Upper-Right Corner
2 X DIMM DDR3 supports 1066/1333/1600/1866/2400(OC) and DDR3 max capacity is 32GB.
Next is 24-PIN power connector.

Upper-Left Corner
AMD new Socket FM1 latch is different with AM2+/AM3, but the cooler is common in use.
Itís 4+1 phase PWM. One phase can supply 30~40W, itís really enough design.
Upper-Left is 4-pin power input.