AMD Latest Llano APU Structure - GIGABYTE A75M-D2H Review
Few months ago, AMD launched new product line called APU.
Itís AMD dual core E-350 CPU which integrate GPU and the chipset is Hudson-M1 FCH.
This combo main competitor is Intel Atom platform, and not popular in consumer market.
E-350 CPU performance is similar to Atom, however, its GPU performance is much better than Atom which even better than AMD own IGP performance.
It breaks the trend of IGP performance slow improvement.
In the past, built-in graphic is integrating in Chipset. Since last year, Intel LGA 1155 platform integrated GPU into CPU.
It makes Intel IGP performance catch up AMD platform. This is the first time Intel lead the IGP performance.
AMD IGP is always the leader in the market.
However, each generation 3D performance improvement is small; it causes the UMA market no breakthrough products.
2011, Intel LGA 1156 changed the trend.
Early this year, Intel launched LGA1155 Sandy Bridge, the performance improves 20~30% more. Intel HD2000/3000 performance is leaping.
Finally, AMD launched new Llano APU high performance IGP structure which is the key role this review.
Llano APU chipset has A75 and A55. So far you only can find A75 products in Taiwan.
First of all, letís see GIGABYTE A75M-D2H package. It is white background and feature and technology logos.
GIGABYTE recently promotes SUPER 4 in entry products. At the first sight, I thought itís new Japanese Super Sentai series...
SUPER 4 are Super Safe, Super Speed, Super Savings, and Super Sound.
If you are interested in, you can search internet to compare with other brands A75 MB.
This year, GIGABYTE mid to high end MB is black PCB design.
Personally, I prefer water blue or sky blue color. A75M-D2H color tone is pretty good.
Itís Micro ATX and size is 24.4 cmx 22.5 cm.
Product manual, quick installation guide, I/O panel, SATA cables and Driver CD.
2 X PCI-E X16, first one is X16 and second one is X4 which support AMD CrossFireX technology
1 X PCI-E X1
1 X PCI
Realtek ALC889 audio chip supports 7.1 channel and High Definition Audio technology.
Realtek RTL8111E LAN chip and TPM module connector in black.
6 X Blue SATA provided by A75. Itís SATA3 and supports RAID 0, RAID 1, RAID 10, JBOD.
Left side has USB 2.0/3.0 front panel connector and right side is DualBIOS.
2 X DIMM DDR3 supports 1066/1333/1600/1866/2400(OC) and DDR3 max capacity is 32GB.
Next is 24-PIN power connector.
AMD new Socket FM1 latch is different with AM2+/AM3, but the cooler is common in use.
Itís 4+1 phase PWM. One phase can supply 30~40W, itís really enough design.
Upper-Left is 4-pin power input.
1 X PS2 KB/MS
1 X S/PDIF Fiber Output
4 X USB 2.0(Red)
2 X USB 3.0(Blue)
1 X RJ-45 LAN
Even though AMD A75 chipset is mid end range, if MOSFET has heat sink will be better.
A75 chipset heat sink is new design this year and the matte handle quality is good.
A75M-D2H use Realtek ALC889 audio chip and GIGABYTE emphasize itís 108dB SNR, Signal-to-Noise Ratio.
If I get time, I will test it with other MBs ALC889 by high end speakers or headset to compare the difference.
BIOS M.I.T. Menu
DDR3 Voltage Control 1.025~1800V
CPU VDDP Voltage Control 0.900~1.480V
CPU Vcore 0.750~1.795V
CPU NB VID Control -0.600~+0.300V
CPU Voltage Control -0.600~+0.400V
AM3 platform can support up to DDR3 1600. FM1 socket can pull clock to DDR3 1866.
IGX Setup Items
You can set share memory as 256, 512 or 1024MB.
Dual-link DVI enable item can support highest resolution to 2560 x 1600.
VGA Core Clock can adjust GPU clock. However, APU 3D performance is not pulling by this item.
Advanced DDR3 Parameters Setup
CORSAIR XMS 8GB DDR3 1600 CL9 OC to 1866 CL8
CPU related items, you can enter IGX setup page from here.
PC Health Status
BIOS items are similar with AM2+/AM3. If you used to use previous AMD platform, it wonít be problem to you.
A75M-D2H provides plenty items for users to fine tune.
CPU: AMD A8-3850
MB: GIGABYTE A75M-D2H
DRAM: CORSAIR CMX8GX3M2A1600C9
VGA: AMD Radeon HD6550D
HD: CORSAIR Performance 3 Series P3-256 SSD
POWER: Thermaltake TR2 450W
Cooler: Thermaltake Jing
OS: Windows7 Ultimate 64bit SP1
CPU is AMD latest A8-3850. There is another model, A6-3650, in the market. Itís also Llano APU structure.
The core name is Llano, 32nm, TDP 100W, clock 2.90GHz and 4MB L2 Cache.
In L2 cache, itís higher than Phenom II 2MB, but itís no L3 cache.
CPU 100.0 X 29 => 2900.1MHz
DDR3 1866.8 CL8 10-8-27 1T
Hyper PI 32M X 4 => 22m 43.084s
CPUMARK 99 => 453
Nuclearus Multi Core => 12559
Fritz Chess Benchmark => 15.08/7240
CrystalMark 2004R3 => 204026
CPU => 3.46 pts
CPU(Single Core) => 0.88 pts
PCMark Vantage => 12276
Windows Experience Index - CPU 7.3
A8-3850 double L2 cache and no L3 cache compare to Phenom II. The performance is similar.
Even though phase in 32nm is exciting for AMD fans. However, they might be upset for same performance.
I do hope Bulldozer 8Core CPU can show users the leap improvement.
DDR3 1333.4 CL6 6-6-18 1T
ADIA64 Memory Read - 8088 MB/s
Sandra Memory Bandwidth - 12640 MB/s
MaXXMEM Memory-Copy -9455 MB/s
DDR3 1600.2 CL7 8-7-24 1T
ADIA64 Memory Read - 9229 MB/s
Sandra Memory Bandwidth - 15266 MB/s
MaXXMEM Memory-Copy - 10655 MB/s
DDR3 1866.8 CL8 10-8-27 1T
ADIA64 Memory Read - 9556 MB/s
Sandra Memory Bandwidth - 16192 MB/s
MaXXMEM Memory-Copy - 10979 MB/s
FM1 DDR3 spec is 1.50V. CPU in default clock, memory can reach DDR3 1866 which is improved.
You can see the performance improve most from DDR3 1333 to 1600. From 1600 to 1866, the improvement is much less.
For DRAM bandwidth, itís weak point for AMD for many years. They should try to solve this issue soonÖ
Temperature(Itís 32℃ in room. All temperature is showed by ℃ in the test below.)
Enter to OS Desktop - 34
CPU Full Speed - 65
Intel Burn Test v2.4，Stress Level Maximum
For temperature, ADIA64 score is much lower and Core Temp only can test single core.
So I pick ADIA64 and Easy Tune6 for standard. Personally, I feel Easy Tune6 is close to real temperature.
Comparing to Athlon II or Phenom II I used to test, the temperature didnít drop much as 32nm.
It might causes by CPU integrated GPU. I hope the future yield rate can improve this issue.
Power Consumption Test
Enter to OS Desktop - 32W
CPU Full Speed - 146W
Intel Burn Test v2.4，Stress Level Maximum
CPU and GPU Full Speed - 171W
OCCT Power Supply Test
BIOS enable Cool&Quiet technology and just enter to OS desktop, the temperature is very good.
CPU full speed, it increases to 113W, and CPU/GPU full speed up to 134W. You can see GPU effect 26W.
The main power consumption of whole system is CPU. Built-in GPU is not high as Desktop system.
A75 chipset native support SATA3. SATA transfer rate is another key for AMD platform.
I use CORSAIR Performance 3 Series, supports SATA3, for higher SSD performance.
Model is P3-256. The size is common 2.5Ē. Capacity is 256GB and weight is 80 grams.
ATTO DISK Benchmark over 32k test is very close to max performance. The reading is 482.5 Mb/s and writing is 328.2 MB/s.
File Benchmark over 512k test the writing is over 300 MB/s.
AS SSD Benchmark
Seq Read - 438.20 MB/s Write - 288.70 MB/s
CrystalDiskMark reading is 444.8 Mb/s and writing is 313.9 MB/s
A75 SATA3 transfer rate is over standard. ATTO max Read/Write can achieve 438/328 MB/s.
In other benchmark software, the scores are not far from official spec. You can see AMD chipset great leap in this part.
It supports 6 SATA3 ports. Itís good for more and more SATA3 HDD or SSD products in the markret.
AMD Radeon HD6550D Performance Test
Default Clock 600MHz
3DMark Vantage => P4450
StreetFighter IV Benchmark
1280 X 720 => 98.62 FPS
FINAL FANTASY XIV
1280 X 720 => 1818
LOST PLANET 2
DX9C 1280 X 720 TEST B - 10.3 fps
A8-3850 built-in Radeon HD6550D and A6-3650 built-in Radeon HD6530D. The spec and performance is a little different.
The test is higher level HD 6550D. 3D performance is close to entry level VGA card. This is impressive part for Llano APU.
Game Benchmark is 3~4 times more than pervious 890GX. You can see the advantage for GPU leading company here.
As Llano APU 3D performance, itís decided by DDR3 clock and CPU FSB.
If you set DDR3 at default 1066, 3DVANTAGE is about P3000.
Comparing to DDR3 1866, 3DVANTAGE increase about 50%.
Of course, APU 3D limitation is not only this. If you OC CPU FSB and higher DDR3 clock, it can be over P6000.
1. 100% Japanese made solid caps, USB 3x power design and On/Off Charge practical features.
2. Rich BIOS items for complete CPU/GPU/DDR3 OC requirement.
3. APU latest IGP technology. Most high end HD 6550D 3D performance is leaping.
4. Native 6 SATA3 and 2 USB 3.0. Also support 2 front USB 3.0 devices.
5. AMD Dual Graphics and Dual-link DVI is good for Gaming or multimedia.
1. CPU PWM has no heat sink.
2. 4 DIMM DDR3 will be better
2. AMD 3850/3650 + A75 MB price is too high currently
C/P Value ★★★★★★★★☆☆
A8-3850 is 32nm which has been waiting for long time by AMD fans.
3D IGP performance is leaping and A75 also supports USB 3.0 and SATA3. It enhances AMD advantages in market competition.
However, for CPU performance, power consumption and temperature is same after moving to 32nm.
Also DDR3 bandwidth hasnít been improved for years. AMD should improve these points soon.
Maybe, the future 8 Cores CPU, Bulldozer, performance will be better.
Llano APU built-in 3D performance is very impressive.
Itís may stimulated by Intel which focus on IGP performance improvement in these 2 years.
AMD(ATI) is one of the two GPU leading manufacturer. However, this time they cannot care entry VGA market profit this time.
After merging ATI, AMD must improve IGP performance to lead in 3D field.
OF course, you wonít disappoint the AMD GPU. HD6550D win back the IGP leading position again.
As previous AMD is for mid to low end market, Llano APU price is higher.
If you think itís X4 955 and entry level VGA, APU platform is cheaper actually.
As AMD just launched Llano APU structure in early July, itís only A75 chipset now. It will have A55 chipset later.
CPU is only A8-3800 and A6-3600. If A6-3600 plus A55 MB, the cost performance will be enhanced.
Intel Sandy Bridge fires the IGP war, and AMD Llano APU hold the leading positon.
Even though they both launched only high end product in the beginning, as new structure be more popular, you will see more mid to entry products.
According to 2011 IGP performance war, I believe users are the final winners.
You can get better performance system with lower price.