what was the purpose of this 96 core build BTW ? for personal fun ,to prove the students can perform cobbling together off the shelf generic kit, or to perform a real test and write a paper etc
Originally Posted by Michael
and when your there Michael please ask them why they didn't get MIT to buy in a load of cheap ARM cortex A9 on sodimm like these http://www.karo-electronics.com/tx53.html and have the Electrical Engineering and Computer Science guys knock up a 100 SODIMM slot carrier board interface to carry all the I/O signals to and from the TX module so as to get something with far lower power usage or just get the company to knock something simple and functional to cluster 10 SODIMM ARM cards with 4 SOC on each.
while the Karo electronics guys only show a set of slower speed Freescale i.MX535, A8 at 1 GHz,
im not sure so check but i think the Freescale i.MX6, 1.2 GHz A9 Quad (its also got 1gigabit Ethernet in soc)is pin compatible with all their other series so MIT could have karo or some other ARM on SODIMM vendors make a striped down PCB with all the ports and power passed on to the
daughter board and a set (2 or 4 per card) of i.MX6 quads per SODIMM
The TX embedded module integrates all the core components of a common PC and is mounted
onto an application specific carrier board. TX modules have a standardized form factor of 67,6mm x
26mm, have specified pinouts and provide the functional requirements for an embedded
application. These functions include, but are not limited to, graphics, network and multiple USB
ports. A single ruggedized SO-DIMM connector provides the carrier board interface to carry all the
I/O signals to and from the TX module. This SO-DIMM connector is a well known and proven high
speed signal interface connector that is commonly used for memory cards in notebooks.
Carrier board designers can utilize as little or as many of the I/O interfaces as deemed necessary.
The carrier board can therefore provide all the interface connectors required to attach the system
to the application specific peripherals. This versatility allows the designer to create a dense and
optimized package, which results in a more reliable product while simplifying system integration.
Most importantly, TX applications are scalable, which means once a product has been developed,
the product range can be diversified by using TX modules with a different performance class.
Simply unplug one module and replace it with another, no redesign is necessary."